Browsing by Author "Diekmann, C."
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Publication 3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring
Proceedings paper2011, International Conference on Solid State Devices and Materials - SSDM, 28/09/2011Publication 3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance
Proceedings paper2011, 41st European Solid-State Device Research Conference - ESSDERC, 12/09/2011, p.127-130