Publication:

3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring

Date

Loading...
Thumbnail Image

Abstract

Description

Metrics

Views

2023 since deposited on 2021-10-19
Acq. date: 2025-10-23

Citations

Metrics

Views

2023 since deposited on 2021-10-19
Acq. date: 2025-10-23

Citations