Publication:

3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring

Date

2011

Proceedings Paper

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Author(s)

;

Majeed, Bivragh

;

;

Posada Quijano, Guillermo

;

;

;

Schmidhammer, E.

;

De Raedt, Walter

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Acq. date: 2026-02-24