Browsing by Author "Dimcic, Biljana"
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Publication Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Meeting abstract2014, 23rd Conference on Materials for Advanced Metallization - MAM, 2/03/2014Publication Cu/Sn microbumps interconnect for 3D TSV chip stacking
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.858-863Publication Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Journal article2012, Microelectronics Reliability, (52) 9_10, p.1971-197Publication Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Journal article2015, Microelectronic Engineering, 140, p.72-80Publication Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage
Proceedings paper2012, IEEE International Reliability Physics Symposium- IRPS, 14/04/2012, p.2B-3Publication Influence of the processing method on the amount and development of voids in miniaturized interconnections
Proceedings paper2010, Electronics System Integration Technology Conference - ESTC, 13/09/2010Publication Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections
Proceedings paper2011, 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.109-113Publication Phase formation in Cu/Ni/Sn thin film system
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012Publication Processing and characterization of Co-Sn intermetallic compounds
Publication Reliability assessment of stretchable interconnect
Meeting abstract2010, IEEE International Microsystems, Packaging, Assembly, and Circuits Technology Conference - IMPACT, 20/10/2010Publication Reliability assessment of stretchable interconnects
Proceedings paper2010, IEEE International Microsystems, Packaging, Assembly and Circuit Technology conference - IMPACT, 20/10/2010Publication Reliability concerns in copper TSV's: methods and results
Proceedings paper2012-07, 19th International Symposium on the Physical & Failure Analysis of Integrated Circuits - IPFA, 2/07/2012