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Browsing by Author "Du, Leiming"

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    Publication

    20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

    Ji, Xinrui
    ;
    Du, Leiming
    ;
    van Zeijl, Henk
    ;
    Zhang, Guoqi
    ;
    Derakhshandeh, Jaber  
    ;
    Beyne, Eric  
    Proceedings paper
    2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.1891-1895

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