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Conference contributions
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Publication:
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Date
2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00221
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ji, Xinrui
;
Du, Leiming
;
van Zeijl, Henk
;
Zhang, Guoqi
;
Derakhshandeh, Jaber
;
Beyne, Eric
Journal
N/A
Abstract
Description
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Views
232
since deposited on 2024-12-07
Acq. date: 2025-10-27
Citations
Metrics
Views
232
since deposited on 2024-12-07
Acq. date: 2025-10-27
Citations