Publication:
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
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246 since deposited on 2024-12-07
1last month
Acq. date: 2026-05-19
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Statistics
Views
246 since deposited on 2024-12-07
1last month
Acq. date: 2026-05-19
Citations