Publication:
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
| dc.contributor.author | Ji, Xinrui | |
| dc.contributor.author | Du, Leiming | |
| dc.contributor.author | van Zeijl, Henk | |
| dc.contributor.author | Zhang, Guoqi | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-04-10T15:00:31Z | |
| dc.date.available | 2024-12-07T16:58:03Z | |
| dc.date.available | 2025-04-10T15:00:31Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00221 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44952 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1891 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 1895 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | 20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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