imec Institutional Repository Browsing {{ collection }} by Author "Dubey, Vikas"

Publication

3D stacking using bump-less process for sub 10μm pitches

Derakhshandeh, Jaber

;

;

;

;

;

Proceedings paper

2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.128-133

Publication

3D thermal model with high spatial and temporal resolution

Dubey, Vikas

;

;

;

;

Proceedings paper

2012, 27th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC, 24/09/2012, p.1339-1342

Publication

Die to wafer 3D stacking for below 10μm pitch microbumps

;

;

;

;

;

Dubey, Vikas

Proceedings paper

2016, IEEE International Conference on 3D System Integration - 3DIC, 9/11/2016, p.1-4

Publication

Effect of insolation on the thermal behaviour of the IPERC and the MWT cell

Dubey, Vikas

;

;

;

;

Oral presentation

2012, I-CAMP 12 Summer School on Renewable & Sustainable Energy

Publication

Fine Pitch 3D-Integration Using Self-Aligned Assembly

Dubey, Vikas

PHD thesis

2017-11

Publication

Fine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si cIEMCBEhips

Dubey, Vikas

;

Derakhshandeh, Jaber

;

Beyne, Eric

;

Celis, Jean Pierre

;

De Wolf, Ingrid

Journal article

2016, IEEE Transactions on Components, Packaging and Manufacturing Technology, (6) 6, p.946-953

Publication

Liquid mediated direct bonding and bond propagation

Dubey, Vikas

;

Derakhshandeh, Jaber

;

O'Callaghan, John

;

Willems, Kherim

;

Rebibis, Kenneth June

Proceedings paper

2016, 6th Electronics System-Integration Technology Conference - ESTC, 13/09/2016, p.1-4

Publication

On the feasibility of die-to-wafer inorganic dielectric bonding

Wang, Teng

;

;

;

;

;

Proceedings paper

2016, 6th Electronics System-Integration Technology Conference - ESTC, 13/09/2016, p.1-5

Publication

Physics of self-aligned assembly at room temperature

Dubey, Vikas

;

Beyne, Eric

;

Derakhshandeh, Jaber

;

De Wolf, Ingrid

Journal article

2018, Physics of Fluids, (30) 1, p.12001

Publication

Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly

Dubey, Vikas

;

Van Huylenbroeck, Stefaan

;

Tutunjyan, Nina

;

Slabbekoorn, John

;

De Wolf, Ingrid

Proceedings paper

2014, 16th IEEE Electronic Packaging Technology Conference - EPTC, 3/12/2014, p.579-582

Publication

Spatial and temporal analysis of wind effects on PV module temperature and performance

Goverde, Hans

;

Goossens, Dirk

;

Govaerts, Jonathan

;

Dubey, Vikas

;

Catthoor, Francky

;

Baert, Kris

Journal article

2015, Sustainable Energy Technologies and Assessments, 11, p.36-41

Publication

Surface treatment to enable low temperature and pressure copper direct bonding

Dubey, Vikas

;

Derakhshandeh, Jaber

;

Beyne, Eric

;

Gerets, Carine

;

Cooper, E.

;

Laermans, Patrick

Proceedings paper

2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.2435-2441

Browsing by Author "Dubey, Vikas"