Browsing by Author "Duflos, Frederic"
Now showing 1 - 4 of 4
- Results Per Page
- Sort Options
Publication Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Proceedings paper2018, 19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE, 16/04/2018, p.1-6Publication Impact induced metal-crush failures
Proceedings paper2007, 14th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA, 11/07/2007, p.209-213Publication Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process
Proceedings paper2009-10, 15th International Workshop on Thermal Investigations of IC's and Systems - THERMINIC, 7/10/2009Publication Low-temperature enbrittlement of lead-free solders in joint level impact testing
Proceedings paper2007-12, 9th Electronics Packaging Conference - EPTC, 10/12/2007, p.140-151