Browsing by Author "Escorcia, Orlando"

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Improved low-k dielectric properties using He/H2 plasma for resist removal

Urbanowicz, Adam
;
Shamiryan, Denis
;
Marsik, Premysl
;
Travaly, Youssef
;
Jonas, Alain
Proceedings paper
2009, Advanced Metallization Conference 2008 (AMC 2008), 22/09/2008, p.593-598
UV-assisted curing: an effective technique for toughening of low-k organosilicate films

Iacopi, Francesca
;
Waldfried, Carlo
;
Houthoofd, Kristof
;
Guyer, Eric
;
Gage, David
Oral presentation
2005, Advanced Metallization Conference