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Browsing by Author "Fehkuhrer, Andreas"

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    Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

    Iacovo, Serena
    ;
    Peng, Lan
    ;
    Nagano, Fuya
    ;
    Uhrmann, Thomas
    ;
    Burggraf, Jurgen
    ;
    Fehkuhrer, Andreas
    Proceedings paper
    2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2097-2104

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