Browsing by Author "Fehkuhrer, Andreas"
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Publication Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
;Iacovo, Serena ;Peng, Lan ;Nagano, Fuya ;Uhrmann, Thomas ;Burggraf, JurgenFehkuhrer, AndreasProceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2097-2104