Publication:

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Date

2021
Proceedings Paper
https://doi.org/10.1109/ECTC32696.2021.00330
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Author(s)

Iacovo, Serena
;
Peng, Lan
;
Nagano, Fuya
;
Uhrmann, Thomas
;
Burggraf, Jurgen
;
Fehkuhrer, Andreas
;
Conard, Thierry
;
Inoue, Fumihiro
;
Kim, Soon-Wook
;
De Vos, Joeri
;
Phommahaxay, Alain
;
Beyne, Eric

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na

Abstract

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