Publication:

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Date

2021
Proceedings Paper
https://doi.org/10.1109/ECTC32696.2021.00330
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dc.contributor.authorIacovo, Serena
dc.contributor.authorPeng, Lan
dc.contributor.authorNagano, Fuya
dc.contributor.authorUhrmann, Thomas
dc.contributor.authorBurggraf, Jurgen
dc.contributor.authorFehkuhrer, Andreas
dc.contributor.authorConard, Thierry
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-04-25T09:54:50Z
dc.date.available2021-11-02T15:55:03Z
dc.date.available2022-04-01T15:11:22Z
dc.date.available2022-04-25T09:54:50Z
dc.date.embargo9999-12-31
dc.date.issued2021
dc.identifier.doi10.1109/ECTC32696.2021.00330
dc.identifier.eisbn978-0-7381-4523-5
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37432
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage2097
dc.source.conferenceIEEE 71st Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateJUN 01-JUL 04, 2021
dc.source.conferencelocationvirtual
dc.source.endpage2104
dc.source.journalna
dc.source.numberofpages8
dc.subject.keywordsSURFACE
dc.title

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

dc.typeProceedings paper
dspace.entity.typePublication
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