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Browsing by Author "Fruhauf, S."

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    Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance

    Fruhauf, S.
    ;
    Himcinschi, C.
    ;
    Rennau, M.
    ;
    Schulze, K.
    ;
    Schulz, S.E.
    ;
    Friedrich, M.
    ;
    Gessner, T.
    Journal article
    2005, Microelectronic Engineering, (82) 3_4, p.405-410

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