Browsing by Author "Funaya, Takuo"
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Publication Alternative patterning techniques enabling fine pitch interconnection on topography surfaces
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.431-434Publication Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Proceedings paper2009, 59th Electronic Components and Technology Conference - ECTC, 26/05/2009, p.1284-1288Publication High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Proceedings paper2008, SEMICON Europe: Advanced Packaging Conference, 7/10/2008Publication Ultra thin chip embedding technology (UTCS-UTCP)
; ; ; Iker, FrancoisOral presentation2010, Embedded Wafer level Packaging Workshop, IMAPS-FrancePublication Ultra thin die embedding technology with 20um-pitch interconnection
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.1575-1580