Browsing by Author "Goel, Sandeep Kumar"
Now showing 1 - 6 of 6
- Results Per Page
- Sort Options
Publication Design and Manufacturing Technology of Advanced Multi-Die Packages on the 'Slope of Enlightenment': Where Is 3D-Test?
Proceedings paper2021, 2021 IEEE European Test Symposium (ETS), 24/05/2021Publication DfT architecture for 3D-SICs with multiple towers
Proceedings paper2011-05, IEEE European Test Symposium - ETS, 23/05/2011, p.51-56Publication DfT architecture for multi-tower 3D-SICs
Oral presentation2011, DATE'11 Friday Workshop on "3D Integration"Publication Low-cost post-bond testing of 3D-ICs containing a passive silicon interposer base
Journal article2014-11, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, (22) 11, p.2388-2401Publication Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
Proceedings paper2011-09, IEEE International Test Conference - ITC, 20/09/2011, p.1-10Publication Test-architecture optimization for TSV-based 3D stacked ICs
Proceedings paper2010, IEEE European Test Symposium - ETS, 24/05/2010, p.24-29