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Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
Publication:
Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
Date
2011-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chi, Chun-Chuan
;
Marinissen, Erik Jan
;
Goel, Sandeep Kumar
;
Wu, Cheng-Wen
Journal
Abstract
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1886
since deposited on 2021-10-19
420
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1886
since deposited on 2021-10-19
420
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations