Publication:
Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
Date
| dc.contributor.author | Chi, Chun-Chuan | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.author | Goel, Sandeep Kumar | |
| dc.contributor.author | Wu, Cheng-Wen | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-19T12:47:45Z | |
| dc.date.available | 2021-10-19T12:47:45Z | |
| dc.date.issued | 2011-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18681 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE International Test Conference - ITC | |
| dc.source.conferencedate | 20/09/2011 | |
| dc.source.conferencelocation | Anaheim, CA USA | |
| dc.source.endpage | 10 | |
| dc.title | Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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