Browsing by Author "Haensel, Leander"
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Publication A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking
Proceedings paper2015, 13th International Wafer Level Packaging Conference - IWLPC, 13/10/2015Publication Molecular glass resist performance for nano-pattern transfer
Proceedings paper2015-03, Advanced Etch Technology for Nanopatterning IV, 22/02/2015, p.94280JPublication Study of wetting of nanostructures using decoration by etching
Proceedings paper2014, Ultra Clean Processing of Semiconductor Surfaces XII - UCPSS XII, 21/09/2014, p.111-114