Browsing by Author "Halas, Simon"
Now showing 1 - 2 of 2
- Results per page
- Sort Options
Publication IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.1843-1847Publication IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.343-347