Browsing by Author "Harkness, Brian"
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Publication Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Proceedings paper2004, EuroSimE: 5th Int. Conf. on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, 10/05/2004, p.163-168Publication Patternable silicones for next generation packaging reliability requirements
Publication Study of the integration of a new elastomeric material in a silicone under the bump configuration
Proceedings paper2004, IMAPS US, 14/11/2004Publication Ultra low stress and low temperature patternable silicone materials for applications within microelectronics
Journal article2004, Microelectronic Engineering, (76) 1_4, p.212-218