Publication:
Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1930 since deposited on 2021-10-15
1last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1930 since deposited on 2021-10-15
1last month
Acq. date: 2025-12-10
Citations