Publication:
Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
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1939 since deposited on 2021-10-15
4last month
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Acq. date: 2026-05-02
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Statistics
Views
1939 since deposited on 2021-10-15
4last month
1last week
Acq. date: 2026-05-02
Citations