Publication:
Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
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1934 since deposited on 2021-10-15
1last month
Acq. date: 2026-02-24
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Statistics
Views
1934 since deposited on 2021-10-15
1last month
Acq. date: 2026-02-24
Citations