Browsing by Author "Heck, John"
Now showing 1 - 3 of 3
- Results per page
- Sort Options
Publication Die-to-die adhesive bonding for evanescently-coupled photonic devices
Proceedings paper2010, Semiconductor Wafer Bonding 11: Science, Technology, and Applications, 10/10/2010, p.411-420Publication Ultra-high data density MEMS memory device
Meeting abstract2009, 35th International Conference on Micro- and Nano Engineering - MNE, 28/09/2009Publication Ultra-high density MEMS probe memory device