Browsing by Author "Heltzel, Stan"
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Publication Advanced PCB technologies for space and their assessment using up-to-date standards
Journal article2023, CEAS SPACE JOURNAL, (15) 1, p.89-100Publication Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Journal article2023, CEAS SPACE JOURNAL, (15) 1, p.101-112Publication High-density interconnect technology assessment of printed circuit boards for space applications
Journal article2020, Journal of Microelectronics and Electronic Packaging, (17) 3, p.79-88