Browsing by Author "Hiebert, S."
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Publication Defect learning methodology applied to microbump process at 20μm pitch and below
Proceedings paper2018, 2018 29th Annual SemI Advanced Semiconductor Manufacturing Conference - ASMC, 30/04/2018, p.10-17Publication In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Proceedings paper2017, 28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC, 15/05/2017, p.331-336Publication What's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging
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