Browsing by Author "Jolley, Mike"
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Publication Evaluation of TSV and micro-bump probing for wide I/O testing
Proceedings paper2011-09, IEEE International Test Conference - ITC, 20/09/2011Publication Test strategies for wide-I/O memory, 3D-TSV technology test vehicles and ultra-fine-pitch applications
Proceedings paper2012-11, IEEE International Workshop on Testing Three-Dimensional Stacked ICs - 3D-TEST, 8/11/2012