Browsing by Author "Judelewicz, Moshe"
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Publication Al speed fill
Journal article1999, Materials Science in Semiconductor Processing, (2) 1, p.75-78Publication Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.290-292Publication Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
Publication Self-annealing characterization of electroplated copper films
Journal article2000, Microelectronic Engineering, (50) 1_4, p.449-457Publication Self-annealing characterization of electroplated copper films
Oral presentation1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.