Self-annealing characterization of electroplated copper films

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Author(s)

Lagrange, Sébastien

;

Brongersma, Sywert

;

Judelewicz, Moshe

;

Saerens, Annelies

;

;

Richard, Emmanuel

;

;

Journal

Microelectronic Engineering

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1972 since deposited on 2021-10-14

Acq. date: 2025-10-23