Browsing by Author "Kögel, Michael"
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Publication Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
Proceedings paper2018-11, International Symposium for Testing and Failure Analysis - ISTFA, 28/10/2018, p.8-11Publication GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces
Proceedings paper2019, 45th International Symposium for Testing and Failure Analysis (ISTFA), 10/11/2019Publication Study of GHz-SAM sensitivity to delamination in BEOL layers
Journal article2017, Microelectronics Reliability, 76-77, p.238-242