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Browsing by Author "Kang, Dong-Suk"

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    Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application

    Jung, In Soo
    ;
    Woo, Jeong-Jun
    ;
    Kwon, Hak Yong
    ;
    Kim, Young-Jae
    ;
    Kang, Dong-Suk
    ;
    Park, Ju-Hyuk
    Meeting abstract
    2011, 11th International Conference on Atomic Layer Deposition - ALD, 26/06/2011

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