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Browsing by Author "Karmarkar, A.P."

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    Modeling copper plastic deformation and liner viscoelastic flow effects on performance and reliability in Through Silicon Via (TSV) fabrication processes

    Karmarkar, A.P.
    ;
    Xu, X.
    ;
    El Sayed, K.
    ;
    Guo, Wei  
    ;
    Van der Plas, Geert  
    ;
    Van Huylenbroeck, Stefaan  
    Journal article
    2019, IEEE Transactions on Device and Materials Reliability, (19) 4, p.642-653

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