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Browsing by Author "Kobayashi, N."

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    Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

    De Roest, David  
    ;
    Vereecke, Bart  
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    Huffman, Craig
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    Heylen, Nancy  
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    Croes, Kristof  
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    Arai, H.
    Oral presentation
    2009, ADMETA 2009
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    Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials

    Travaly, Youssef
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    Van Aelst, Joke  
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    Truffert, Vincent  
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    Verdonck, Patrick  
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    Dupont, Tania  
    Proceedings paper
    2008, 11th IEEE International Interconnect Technology Conference - IITC, 1/06/2008, p.52-54
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    Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route

    De Roest, David  
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    Travaly, Youssef
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    Beynet, Julien
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    Sprey, Hessel  
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    Labat, Julianne
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    Huffman, Craig
    Meeting abstract
    2009, 18th Workshop Materials for Advanced Metallization - MAM, 8/03/2009

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