Browsing by Author "Kumar, Nirajan"
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Publication On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing
Journal article2013, Microelectronic Engineering, 106, p.155-159Publication Thermal stability of copper through-silicon via barriers during IC processing
Proceedings paper2011, IEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM, 8/05/2012, p.P2.51