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Thermal stability of copper through-silicon via barriers during IC processing
Publication:
Thermal stability of copper through-silicon via barriers during IC processing
Date
2011
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Civale, Yann
;
Croes, Kristof
;
Miyamori, Yuichi
;
Thangaraju, Sarasvathi
;
Redolfi, Augusto
;
Van Ammel, Annemie
;
Velenis, Dimitrios
;
Cherman, Vladimir
;
Hendrickx, Paul
;
Van der Plas, Geert
;
Cockburn, Andrew
;
Gravey, Virginie
;
Kumar, Nirajan
;
Zhitao, Cao
;
Sabuncuoglu Tezcan, Deniz
;
Soussan, Philippe
;
Travaly, Youssef
;
Tokei, Zsolt
;
Beyne, Eric
;
Swinnen, Bart
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1887
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1887
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations