Publication:

Thermal stability of copper through-silicon via barriers during IC processing

Date

2011
Proceedings Paper
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dc.contributor.authorCivale, Yann
dc.contributor.authorCroes, Kristof
dc.contributor.authorMiyamori, Yuichi
dc.contributor.authorThangaraju, Sarasvathi
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorCherman, Vladimir
dc.contributor.authorHendrickx, Paul
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorCockburn, Andrew
dc.contributor.authorGravey, Virginie
dc.contributor.authorKumar, Nirajan
dc.contributor.authorZhitao, Cao
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.contributor.authorTravaly, Youssef
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorHendrickx, Paul
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T12:51:04Z
dc.date.available2021-10-19T12:51:04Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18701
dc.source.beginpageP2.51
dc.source.conferenceIEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM
dc.source.conferencedate8/05/2012
dc.source.conferencelocationDresden Germany
dc.title

Thermal stability of copper through-silicon via barriers during IC processing

dc.typeProceedings paper
dspace.entity.typePublication
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