Browsing by Author "Kurz, Florian"
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Publication 3D-SoC integration utilizing high accuracy wafer level bonding
Proceedings paper2016, IEEE 18th Electronics Packaging Technology Conference - EPTC, 30/11/2016, p.111-114Publication Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications
Meeting abstract2017, The International Conference on Wafer Bonding - Waferbond, 27/11/2017