Publication:

3D-SoC integration utilizing high accuracy wafer level bonding

Date

2016
Proceedings Paper
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Author(s)

Peng, Lan  
;
Kim, Soon-Wook  
;
Heylen, Nancy  
;
Reichardt, Maik
;
Kurz, Florian
;
Wagenleitner, Thomas
;
Sleeckx, Erik  
;
Struyf, Herbert  
;
Rebibis, Kenneth June  
;
Miller, Andy  
;
Beyer, Gerald  
;
Beyne, Eric  

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Abstract

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