Browsing by Author "Larson, L."
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Publication Introducing a silicone under the bump configuration for stress relief in a wafer level package
Proceedings paper2003, Proceedings EPTC - Electronics Packaging Technology Conference, 11/12/2003, p.380-384Publication Optimization of a silicone under the bump (SUB) structure for wafer level packaging
Proceedings paper2003, Proceedings of the 14th European Microelectronic Packaging Conference and Exhibition - IMAPS Europe, 23/06/2003, p.479-484