Browsing by Author "Lernout, Jo"
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Publication A five layer thin film MCM-Si design using oxynitride dielectrics
Oral presentation1997, IMAPS/NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics; May 1997; Bled, SlovenPublication A five layer thin film MCM-Si design using oxynitride dielectrics
Proceedings paper1997, Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy., p.637-640Publication A five-layer thin film MCM-Si design using oxynitride dielectrics
Journal article1998, Microelectronics International (Hybrid Circuits), (15) 1, p.39-42Publication Design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator
Proceedings paper1998, 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnection Technology in Ele, 15/06/1998, p.7-9Publication Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities
Journal article2000, Microelectronics Reliability, (40) 1, p.163-170Publication Micro-cavity LED's and their application in optical interconnect research within the IUAP-24 project
; ; Publication Multilayer motherboard technology in MCM-Si with opto-electronic features
Proceedings paper1998, Proceedings of the IMAPS International Symposium on Microelectronics, 1/11/1998, p.347-352Publication Optimalisatie en karakterisatie van PECVD siliciumoxinitridelagen - Toepassing in een dunne film multichipmodule op silicium
Lernout, JoPHD thesis1998-11Publication Stable a-SiN:H TFD for use in X-ray environment
Proceedings paper1995, Proceedings of Fifteenth International Display Research Conference.Asia Display '95; October 1995; Hamamatsu, Japan., p.297-300Publication Technology and circuit aspects of reflective PNLC microdisplays
Proceedings paper1997, Proceedings of the 17th International Display Research Conference 1997; Toronto, Canada; September 1997., p.195-198Publication Two-layer silicon hybrids interconnect
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.162-171Publication Two-layer silicon hybrids interconnect technology
Proceedings paper1995, Proceedings 1995 International Conference on Multichip Modules; April 1995; Denver, Colorado, USA., p.375-380