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    Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity

    Zhang, Wenqi
    ;
    Brongersma, Sywert  
    ;
    Li, Zhen
    ;
    Li, dagang
    ;
    Richard, Olivier  
    ;
    Maex, Karen  
    Journal article
    2007, Journal of Applied Physics, (101) 6, p.63703

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