Browsing by Author "Maehara, Masataka"
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Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication IMC Assisted Die-bonding for Stacked Device Integration
Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024