Publication:

IMC Assisted Die-bonding for Stacked Device Integration

Date

2024
Proceedings Paper
https://doi.org/10.1109/estc60143.2024.10712004
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Author(s)

Maehara, Masataka
;
Derakhshandeh, Jaber  
;
Gerets, Carine  
;
Cochet, Tom  
;
Cuypers, Dieter  
;
Miller, Andy  
;
Beyer, Gerald  
;
Van der Plas, Geert  
;
Beyne, Eric  

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N/A

Abstract

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240 since deposited on 2025-02-15
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