Publication:

IMC Assisted Die-bonding for Stacked Device Integration

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESTC60143.2024.10712004

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Author(s)

Maehara, Masataka

;

Derakhshandeh, Jaber

;

;

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Cuypers, Dieter H.

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Van der Plas, Geert

;

Journal

N/A

Metrics

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Acq. date: 2025-12-15