Publication:
IMC Assisted Die-bonding for Stacked Device Integration
| dc.contributor.author | Maehara, Masataka | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Gerets, Carine | |
| dc.contributor.author | Cochet, Tom | |
| dc.contributor.author | Cuypers, Dieter H. | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.imecauthor | Gerets, Carine | |
| dc.contributor.imecauthor | Cochet, Tom | |
| dc.contributor.imecauthor | Cuypers, Dieter H. | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.contributor.orcidimec | Gerets, Carine::0009-0007-2069-6032 | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-04-16T08:29:37Z | |
| dc.date.available | 2025-02-15T21:13:59Z | |
| dc.date.available | 2025-04-16T08:29:37Z | |
| dc.date.issued | 2024 | |
| dc.description.wosFundingText | This work was supported in mainly part by IMEC in Belgium. We extend our gratitude to many members in 3D program and Core CMOS activity at IMEC. | |
| dc.identifier.doi | 10.1109/ESTC60143.2024.10712004 | |
| dc.identifier.eisbn | 979-8-3503-9036-0 | |
| dc.identifier.isbn | 979-8-3503-9037-7 | |
| dc.identifier.issn | 2687-9700 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45213 | |
| dc.publisher | IEEE | |
| dc.source.conference | 10th IEEE Electronics System-Integration Technology Conference (ESTC) | |
| dc.source.conferencedate | SEP 11-13, 2024 | |
| dc.source.conferencelocation | Berlin | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | IMC Assisted Die-bonding for Stacked Device Integration | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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