Publication:

IMC Assisted Die-bonding for Stacked Device Integration

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712004
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dc.contributor.authorMaehara, Masataka
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorGerets, Carine
dc.contributor.authorCochet, Tom
dc.contributor.authorCuypers, Dieter
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorCuypers, Dieter H.
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecGerets, Carine::0009-0007-2069-6032
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-04-16T08:29:37Z
dc.date.available2025-02-15T21:13:59Z
dc.date.available2025-04-16T08:29:37Z
dc.date.issued2024
dc.description.wosFundingTextThis work was supported in mainly part by IMEC in Belgium. We extend our gratitude to many members in 3D program and Core CMOS activity at IMEC.
dc.identifier.doi10.1109/ESTC60143.2024.10712004
dc.identifier.eisbn979-8-3503-9036-0
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45213
dc.publisherIEEE
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
dc.source.numberofpages5
dc.title

IMC Assisted Die-bonding for Stacked Device Integration

dc.typeProceedings paper
dspace.entity.typePublication
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