Browsing by Author "Mitsukura, Kazuyuki"
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Publication 3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Proceedings paper2016, IEEE 18th Electronic Packaging Technology Conference - EPTC, 30/11/2016, p.791-796Publication Development and evaluation of photodefinable wafer level underfill
Publication Photosensitive insulation coating for a copper redistribution layer process
Proceedings paper2014, IEEE CPMT Symposium Japan "Packaging for Future Optoelectroni cs, RF/High-Speed Electronics and Bioelectronics", 4/11/2014, p.111-113