imec Institutional Repository Browsing {{ collection }} by Author "Moroz, V."

Publication

3D technology roadmap and status

Marchal, Pol

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Van der Plas, Geert

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Eneman, Geert

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Moroz, V.

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Badaroglu, Mustafa

Proceedings paper

2011, IEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM, 8/05/2011

Publication

Analysis of microbump induced stress effects in 3D stacked IC technologies

Ivankovic, Andrej

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Van der Plas, Geert

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Moroz, V.

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Choi, M.

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Cherman, Vladimir

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Mercha, Abdelkarim

Proceedings paper

2012, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.9-Apr

Publication

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances

Mercha, Abdelkarim

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Van der Plas, Geert

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Moroz, V.

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De Wolf, Ingrid

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Asimakopoulos, Panagiotis

Proceedings paper

2010, IEEE International Electron Devices Meeting - IEDM, 6/12/2010, p.26-29

Publication

Noise coupling between TSVs and active devices: planar nMOSFETs vs. nFinFETs

Sun, Xiao

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Rouhi Najaf Abadi, Alireza

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Guo, Wei

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Bel Ali, K.

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Rack, M.

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Roda Neve, Cesar

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Choi, M.

Proceedings paper

2015, IEEE 65th Electronic Components & Technology Conference - ECTC, 26/05/2015, p.260-265

Publication

Through silicon via to FinFET noise coupling in 3-D integrated circuits

Rouhi Najaf Abadi, Alireza

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Guo, Wei

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Sun, Xiao

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Ben Ali, K.

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Raskin, J.P

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Rack, M.

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Roda Neve, Cesar

Proceedings paper

2015, International Conference on IC Design and Technology - ICICDT, 1/06/2015, p.1-4

Browsing by Author "Moroz, V."