Browsing by Author "Nguyen, Ha-Ai"
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Publication Microbump lithography for 3D stacking applications
Meeting abstract2013, 10th International Wafer-Level Packaging Conference - IWPLC, 4/11/2013Publication One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material
Proceedings paper2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 4/12/2018, p.395-400Publication One micron redistribution for fan-out wafer level packaging
Proceedings paper2017, IEEE 19th Electronics Packaging Technology Conference - EPTC, 6/12/2017, p.1-7