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Microbump lithography for 3D stacking applications
Publication:
Microbump lithography for 3D stacking applications
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Date
2013
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jaenen, Patrick
;
Slabbekoorn, John
;
Miller, Andy
;
Flack, Warren W.
;
Ranjan, Manish
;
Kenyon, Gareth
;
Hsieh, Robert
;
Nguyen, Ha-Ai
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Views
1901
since deposited on 2021-10-21
4
last month
3
last week
Acq. date: 2025-12-11
Citations