Publication:
Microbump lithography for 3D stacking applications
Date
| dc.contributor.author | Jaenen, Patrick | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Flack, Warren W. | |
| dc.contributor.author | Ranjan, Manish | |
| dc.contributor.author | Kenyon, Gareth | |
| dc.contributor.author | Hsieh, Robert | |
| dc.contributor.author | Nguyen, Ha-Ai | |
| dc.contributor.imecauthor | Jaenen, Patrick | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.date.accessioned | 2021-10-21T08:30:21Z | |
| dc.date.available | 2021-10-21T08:30:21Z | |
| dc.date.issued | 2013 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/22535 | |
| dc.source.conference | 10th International Wafer-Level Packaging Conference - IWPLC | |
| dc.source.conferencedate | 4/11/2013 | |
| dc.source.conferencelocation | San Jose, CA USA | |
| dc.title | Microbump lithography for 3D stacking applications | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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