Browsing by Author "Pargfrieder, Stefan"
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Publication BCB collective bonding for 3D stacking
Meeting abstract2007-12, International Workshop on Wafer Bonding for MEMS Technologies and Wafer Level Integration, 9/12/2007Publication Impact of thinning and packaging on a deep sub-micron CMOS product
; Yang, YuOral presentation2009, Design, Automation & Test in Europe Conference -DATE : Workshop on 3D Integration (W5)