Browsing by Author "Park, SungHo"
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Publication Thermal-Mechanical behavior of highly (111)-oriented Nano Twinned Electroplated copper for advanced electronic packaging
Proceedings paper2025, 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.958-964Publication Wafer-Level Electrochemical Deposition and Processing of Nanotwinned Cu RDL
Proceedings paper2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024