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Browsing by Author "Peeters, J."

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    Structure-activity relationship for the addition of OH to (Poly)alkenes: site-specific and total rate constants

    Peeters, J.
    ;
    Boullart, Werner  
    ;
    Pultau, V.
    ;
    Vandenberk, S.
    ;
    Vereecken, L.
    Journal article
    2007, Journal of Physical Chemistry A, (2007) 111, p.1618-1631
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    Substrate Interconnect Architecture and IC Design Requirements for an D-Type MCM Active Test Structure

    Truzzi, Claudio
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    Peeters, J.
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    Beyne, Eric  
    ;
    Chiadò Piat, A.
    ;
    Sartori, M.
    Proceedings paper
    1994, Proceedings of the International Conference on Electronic Technologies; June 6-8, 1994; Windsor, UK., p.219-226
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    Thermo-mechanical analysis of flip chip on substrate bumps - assemblies

    Vandevelde, Bart  
    ;
    Christiaens, Filip
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    Beyne, Eric  
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    Roggen, Jean
    ;
    Peeters, J.
    ;
    Allaert, K.
    Proceedings paper
    1997, Proceedings of the 11th ISHM European Microelectronics Conference - EMC, 14/05/1997, p.603-606
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    Thermomechanical models for leadless solder interconnections in flip chip assemblies

    Vandevelde, Bart  
    ;
    Christiaens, Filip
    ;
    Beyne, Eric  
    ;
    Roggen, Jean
    ;
    Peeters, J.
    ;
    Allaert, K.
    Journal article
    1998, IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A, (21) 1, p.177-85
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    Zinc oxide: a promising material for improving future food packaging

    Jaspers, L.
    ;
    Lepot, N.
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    Elen, Ken  
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    Peeters, J.
    ;
    Mullens, J.
    ;
    Hardy, An  
    ;
    Van Bael, Marlies  
    Oral presentation
    2010, Nanotechnology in the Food Chain: Opportunities and Risks, International Symposium

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